Heat Sink

Maximize Thermal Performance with the High‑Heat‑Flux Aluminum Heat Sink

This passive heat sink is engineered to efficiently dissipate heat from high‑power ICs, power modules, and LED drivers. Its compact, finned design provides a large surface area while maintaining a lightweight footprint, making it ideal for space‑constrained applications. The heat sink’s highly polished aluminum construction assures excellent thermal conductivity, ensuring reliable operation even under demanding thermal loads.

Designed for both board‑mount and surface‑mount applications, it features a uniform fin spacing that optimizes airflow across a range of fan speeds. The integrated mounting holes accommodate standard SMT and through‑hole fasteners, simplifying assembly in both prototyping and production environments. Its robust finish resists oxidation, extending the lifespan of the component in harsh industrial settings.

• Key Spec 1: Thermal Resistance: 0.42 °C/W (typ.)
• Key Spec 2: Material: 99 % pure aluminum (6061‑T6) with anodized finish
• Key Spec 3: Fin Density: 20 fins per 2 cm, total surface area 140 cm²
• Common Use Case: Mounting on high‑power LED drivers, MOSFETs, and voltage regulator ICs for PCB power stage cooling