Soldering wire

Soldering Wire: Precision Rosin-Flux Lead-Free Alloy for Pro‑Grade Thermal Connectivity

This high‑performance soldering wire is engineered for reliable, repeatable joins in modern electronic assemblies. Encased in a pure rosin‑flux core, it eliminates oxidation and ensures a clean, low‑residual surface for optimal electrical continuity. The lead‑free Sn‑Ag‑Cu alloy not only meets RoHS compliance but also delivers superior mechanical strength and thermal conductivity, keeping joint temperatures modest while maintaining a robust bond.

Available in a range of diameters from 0.3 mm to 0.6 mm and lengths of 200 m per spool, the wire is flexible enough for both hand soldering and automated processes. Its consistent diameter and flux content provide a predictable melting point (183 °C–198 °C), ideal for surface‑mount device (SMD) work and quality‑critical prototype builds. The wire’s low callus rate and excellent coating uniformity reduce rework time, making it a staple in precision PCBA workflows.

• Key Spec 1: Flux Core – 100 % rosin‑based, pre‑filled for oxidation prevention
• Key Spec 2: Alloy Composition – Sn96.5 Ag3.5 Cu (lead‑free, ροs‑f) with 99 % purity
• Key Spec 3: Wire Diameter & Size – 0.3 mm to 0.6 mm, 200 m per spool, 183 °C–198 °C melting point
• Common Use Case: Surface‑mount and through‑hole soldering on PCBs requiring RoHS compliance and low-temperature joints in prototyping and low‑volume production